- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Patent holdings for IPC class B23K 26/364
Total number of patents in this class: 755
10-year publication summary
|
33
|
66
|
69
|
93
|
121
|
86
|
100
|
95
|
82
|
24
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1745 |
98 |
| Nippon Steel Corporation | 5649 |
19 |
| POSCO Co., Ltd. | 1059 |
17 |
| Applied Materials, Inc. | 16587 |
15 |
| Corning Incorporated | 9932 |
14 |
| POSCO | 2222 |
12 |
| Hamamatsu Photonics K.K. | 4161 |
11 |
| TRUMPF Laser- und Systemtechnik GmbH | 505 |
11 |
| Nitto Denko Corporation | 7879 |
10 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
9 |
| Samsung Display Co., Ltd. | 30585 |
8 |
| Asmpt Singapore Pte. Ltd. | 189 |
8 |
| Sumitomo Rubber Industries, Ltd. | 4421 |
7 |
| IPG Photonics Corporation | 494 |
7 |
| Polyplastics Co., Ltd. | 563 |
7 |
| Avery Dennison Retail Information Services LLC | 1067 |
6 |
| Baoshan Iron & Steel Co., Ltd. | 832 |
6 |
| JENOPTIK Automatisierungstechnik GmbH | 50 |
6 |
| Tokyo Seimitsu Co., Ltd. | 257 |
6 |
| General Electric Company | 18133 |
5 |
| Other owners | 473 |